Deico
×
Contact Form

Solutions

PCB Assembly

DEICO has the appropriate infrastructure for the assembly of cards that contain dense components and are expected to operate in difficult environmental conditions.

Electronic manufacturing processes are carried out according to IPC-610 Class-3 and the products are controlled according to this standard.

The electronic production infrastructure includes the following equipment:

  • High-speed pick & place machine
  • Fully automatic SMT line
  • Oven with 8 temperature zones
  • Automatic optical inspection machine
  • X-ray inspection
  • Conformal coating application
PCB Assembly
PCB Assembly

The PCB assembly service process includes the following steps.

  • Component procurement
  • PCB procurement
  • Incoming quality check
  • Proper storage
  • Automated solder pasting and inspection
  • SMT assembly
  • Handling of moisture sensitive components
  • AOI inspection
  • X-Ray inspection
  • Conformal coating
  • Nitrogen reflow soldering
  • Boundary scan (JTAG) testing
  • Functional testing
  • ESS Test
  • Test data logging
  • Rework
  • Final quality check
  • ESD packing
  • Shipment
  • ERP integrated operations
PCB Assembly